Digi XBee® 3 Low-Power LTE-M/NB-IoT, GNSS, no SIM

The Digi XBee 3 global cellular module is a compact, cutting-edge solution designed for rapid integration of cellular IoT capabilities. Equipped with cellular and BLE connectivity, end-device carrier certifications, and global positioning capabilities, it offers a seamless system for secure wireless devices with global connectivity. The combination of the XBee ecosystem and cellular functionality simplifies data management over a cellular connection.

Optimized for low-power, low-data applications like asset tracking and smart sensors, the module supports Cellular LTE-M and NB-IoT, handling under 5MB of data per month. It features a power-saving mode to extend battery life and deployment time. Note that it does not come with a SIM card or data plan, but options are available in the related products section.

To support cellular IoT development, the XBee 3 package includes an array of MicroPython programming resources, the intuitive XBee Studio tool suite, and a 12-month subscription to the Digi Remote Manager® for each module, enabling remote software updates and monitoring. The Digi XBee Studio accelerates development, production, and deployment, enhancing cellular IoT implementation.

Features:

• Hardware

  • Cellular Chipset: Telit ME310G1-WW
  • Form factor: Digi XBee® 20-pin through-hole
  • Antenna options: 1 U.FL cellular, 1 U.FL Bluetooth®, 1 U.FL GNSS
  • Dimensions: 24.38 mm x 32.94 mm
  • Operating temperature: −40 ºC to 85 ºC
  • SIM size: 4FF Nano

• Interface and I/O

  • Data interface: UART, SPI, USB
  • Operating modes (LTE-M): Transparent and API over serial, PPP over USB
  • Operating modes (NB-IoT): Transparent, API, UDP
  • Security: Digi TrustFence® with secure boot and protected JTAG
  • Configuration tools: Digi XBee Studio® (local), Digi Remote Manager® (OTA)
  • Embedded programmability: MicroPython with 1024 kB flash / 64 kB RAM
  • I/O: 4 ADC lines (10-bit), 13 digital I/O, USB, I2C
  • Bluetooth: Bluetooth Low Energy (BLE)

• Cellular characteristics

  • Transmit power: Up to 23 dBm (LTE-M/NB-IoT), up to 33 dBm (2G)
  • Receive sensitivity (LTE-M): −105 dBm
  • Receive sensitivity (NB-IoT): −113 dBm
  • Supported bands: LTE Bands B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B27, B28, B66, B71, B85; 2G Bands B2, B3, B5, B8
  • Downlink / uplink speeds (LTE-M): Up to 588 kbps downlink, up to 1 Mbps uplink
  • Downlink / uplink speeds (NB-IoT): Up to 120 kbps downlink, up to 160 kbps uplink
  • Downlink / uplink speeds (2G): Up to 264 kbps downlink, up to 210 kbps uplink
  • Duplex mode: Half-duplex

• Power requirements (at 3.3 VDC input power)

  • Supply voltage: 3.3 – 4.3 VDC
  • Peak transmit current: 550 mA with Bluetooth disabled; 610 mA with Bluetooth enabled
  • Avg transmit current (LTE-M): 1.25 A peak, 410 mA average (GM2 modules)
  • Avg transmit current (NB-IoT): 1.3 A peak, 410 mA average (GM2 modules)
  • Avg transmit current (2G): 2.1 A peak, 320 mA average (GM2 modules)
  • Idle: 200 mA peak, 100 mA average
  • Power save mode: 20 μA
  • Deep sleep: 2.65 μA

• Regulatory and carrier approvals*

  • FCC (USA): MCQ-XB3M2
  • ISED (Canada): 1846A-XB3M2
  • CE / RED (Europe): Complete
  • UKCA (United Kingdom): Complete
  • Japan: Pending
  • Brazil: Pending
  • Mexico (NOM): Pending
  • PTCRB, AT&T and Verizon: Complete

Documents:

• Datasheet