Heat dissipation

Components often generate heat, which in some cases has to be dissipated, heatsinks are made for that. With conductive paste (thermal compound) between the chip and the heat sink, all irregularities are eliminated, making heat transfer as efficient as possible.
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Components often generate heat, which in some cases has to be dissipated, heatsinks are made for that. With conductive paste (thermal compound) between the chip and the heat sink, all irregularities are eliminated, making heat transfer as efficient as possible.





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