Soldering flux - gel - 10g

This product is suitable for PCB, BGA, CSP, soldering and post-processing. Halogen-free and lead-free. Good activity and stable performance. The added solvent is organic resin contained. Moderate viscosity and good rheology.

Characteristics

• DANGER: Causes serious eye irritation
• May cause an allergic skin reaction

Specifications

• shape and color: transparent liquid
• smell: slightly pungent smell
• pH value: 4-5
• flammability: not flammable
• density (g/cm³): 0.77-0.795
• boiling point: 235 °C-255 °C
• melting point: 130°C-150°C
• decomposition temperature: does not decompose easily
• solubility: insoluble in water
• weight: 10g