The Sparkfun Heatsink Compound is a 5g syringe filled with a high-quality thermal paste designed to enhance heat dissipation when connecting components to a heatsink. The compound is a blend of 50% silicone, 20% carbon, and 30% metal oxide, which gives it excellent thermal conductivity of 1.172 W/(mK). This makes it a perfect choice for various applications including voltage regulators, MOSFETs, motor drivers, and audio amplifiers.
The compound is white in color and has a thermal impedance of 0.195 -in²/W. It also boasts a specific gravity of 2.3 @25°C, making it a stable and reliable option for various applications. The compound's evaporation rate is just 0.001% over 24 hours at 150°C, and it bleeds only 0.05% over the same period and temperature. This low evaporation and bleed rate ensure that the compound stays where it's applied, providing consistent thermal conductivity over time.
The Sparkfun Heatsink Compound can bear temperatures ranging from -50°C to 240°C and can operate efficiently in temperatures from -30°C to 180°C. These wide temperature ranges make it a versatile choice for a variety of projects and applications.
This compound is not just for electronics enthusiasts. It's also suitable for anyone who needs to dissipate heat efficiently in their devices. Whether you're a professional working on a large-scale project or a hobbyist working on a personal project, this compound can help you achieve optimal performance and longevity from your components.
For additional safety and usage information, you can refer to the Material Safety Data Sheet (MSDS) provided by Sparkfun.