
The KOELELEMENT TO220/TO3P 15.5°C/W delivers optimal thermal performance with a compact structure, featuring connected pins for seamless integration. Designed for efficiency, it ensures your components run cool under high load conditions.
Enhance device durability and uptime with this heat sink, drawing heat away efficiently like a portable oasis for your high-power elements. Suitable for vertical and horizontal mounting, its versatile design effortlessly slots into tight spaces.
The innovative fin design optimizes airflow, cutting down resistance and boosting dissipation rates. Ideal for extending component lifespan in gadgets or larger systems, this heat-containing powerhouse is your go-to for stress-free electronics management.
| Brand | L.D.S. |
| Model | ML8 |
| Housing | It looks like you're referring to types of semiconductor or transistor packages. The TO220 and TO3P are styles of casings used to house electronic components. Is there something specific you'd like to translate or know about these in English? |
| It seems like you want me to translate "RTH" to English. However, "RTH" doesn't appear to be a word in a language that can be directly translated to English. Could you provide more context or clarify what "RTH" refers to? | 15.5°C/W |
| Dimensions | 30 x 25 x 13mm |
| Note | using 5mm knitting needles |